FS-1 Mapping Systems

Automated film thickness mapping systems FS-XY150 and FS-RT300 combine an FS‑1™ Multi-Wavelength Ellipsometer with compact mapping stages to provide fast, accurate, and reliable film thickness uniformity measurements across a wafer.

FS-XY150In situ
  • Typical time for wafer map: 60 seconds
    (49 points on a 150 mm diameter wafer)
  • Compact footprint: 600×600 mm, 16 kg
  • Stage travel (X,Y): 150 x 150 mm, resolution: 5 μm

 

FS-RT300In situ
  • Typical time for wafer map: 90 seconds
    (49 points on a 300 mm diameter wafer)
  • Compact footprint: 400×500 mm, 22 kg
  • Stage travel: R (linear) 150 mm, resolution: 12 μm
    Theta (rotation) 360°, resolution: 0.1°